Winbond Electronics Corporation America
H‑1B Sponsor Verified
Yes. Winbond Electronics Corporation America filed 5 H-1B labor condition applications (LCAs) with the U.S. Department of Labor from 2023–2026, including 2 so far in 2026. The average H-1B salary is $139,680 and the most sponsored role is Logic Design Engineer.
Source: U.S. Department of Labor LCA disclosure data. Most recent filing on record: Feb 26, 2026.
LinkedIn ↗Latest Year Filings
2
In 2026
↗ Filter by year
Total H‑1B Filings
5
Since 2020
↗ View records
Avg Annual Salary
$139,680
All years combined
↗ View chart
Top Role
Logic Design Engineer
↗ Click to filter
Filing trend
H‑1B filings by year for Winbond Electronics Corporation America
| Year | LCA filings | Avg salary |
|---|---|---|
| 2026 | 2 | $145,298 |
| 2024 | 2 | $140,410 |
| 2023 | 1 | $126,984 |
Click a bar to filter records
Yearly filings & average salary · swipe to explore
SponsorStats AI
Summary