Winbond Electronics Corporation America

H‑1B Sponsor Verified

Yes. Winbond Electronics Corporation America filed 5 H-1B labor condition applications (LCAs) with the U.S. Department of Labor from 2023–2026, including 2 so far in 2026. The average H-1B salary is $139,680 and the most sponsored role is Logic Design Engineer.

Source: U.S. Department of Labor LCA disclosure data. Most recent filing on record: Feb 26, 2026.

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Latest Year Filings
2
In 2026
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Total H‑1B Filings
5
Since 2020
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Avg Annual Salary
$139,680
All years combined
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Top Role
Logic Design Engineer
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Filing trend H‑1B filings by year for Winbond Electronics Corporation America
YearLCA filingsAvg salary
20262$145,298
20242$140,410
20231$126,984
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