Radinnova, Inc.
H‑1B Sponsor Verified
Yes. Radinnova, Inc. filed 18 H-1B labor condition applications (LCAs) with the U.S. Department of Labor from 2020–2025, including 1 in 2025. The average H-1B salary is $96,873 and the most sponsored role is Software Developer.
Source: U.S. Department of Labor LCA disclosure data. Most recent filing on record: Jul 9, 2025.
LinkedIn ↗Latest Year Filings
1
In 2025
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Total H‑1B Filings
18
Since 2020
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Avg Annual Salary
$96,873
All years combined
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Top Role
Software Developer
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Filing trend
H‑1B filings by year for Radinnova, Inc.
| Year | LCA filings | Avg salary |
|---|---|---|
| 2025 | 1 | $78,000 |
| 2024 | 6 | $97,679 |
| 2023 | 3 | $112,000 |
| 2022 | 2 | $91,853 |
| 2021 | 3 | $92,644 |
| 2020 | 3 | $94,000 |
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Yearly filings & average salary · swipe to explore
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Summary