Dish Wireless LLC
H‑1B Sponsor Verified
Yes. Dish Wireless LLC filed 735 H-1B labor condition applications (LCAs) with the U.S. Department of Labor from 2021–2026, including 133 so far in 2026. The average H-1B salary is $109,643 and the most sponsored role is Senior Engineer - Wireless.
Source: U.S. Department of Labor LCA disclosure data. Most recent filing on record: Jun 29, 2026.
LinkedIn ↗Latest Year Filings
133
In 2026
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Total H‑1B Filings
735
Since 2020
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Avg Annual Salary
$109,643
All years combined
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Top Role
Senior Engineer - Wireless
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Filing trend
H‑1B filings by year for Dish Wireless LLC
| Year | LCA filings | Avg salary |
|---|---|---|
| 2026 | 133 | $120,332 |
| 2025 | 95 | $115,466 |
| 2024 | 147 | $109,996 |
| 2023 | 184 | $104,215 |
| 2022 | 136 | $104,397 |
| 2021 | 40 | $101,786 |
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Yearly filings & average salary · swipe to explore
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Summary