Dish Wireless, LLC
H‑1B Sponsor Verified
Yes. Dish Wireless, LLC filed 139 H-1B labor condition applications (LCAs) with the U.S. Department of Labor from 2022–2025, including 125 in 2025. The average H-1B salary is $108,192 and the most sponsored role is Senior Engineer-wireless.
Source: U.S. Department of Labor LCA disclosure data. Most recent filing on record: Sep 25, 2025.
LinkedIn ↗Latest Year Filings
125
In 2025
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Total H‑1B Filings
139
Since 2020
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Avg Annual Salary
$108,192
All years combined
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Top Role
Senior Engineer-wireless
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Filing trend
H‑1B filings by year for Dish Wireless, LLC
| Year | LCA filings | Avg salary |
|---|---|---|
| 2025 | 125 | $106,601 |
| 2024 | 10 | $120,718 |
| 2022 | 4 | $126,578 |
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Yearly filings & average salary · swipe to explore
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Summary