Dish Wireless L.l.c.
H‑1B Sponsor Verified
Yes. Dish Wireless L.l.c. filed 51 H-1B labor condition applications (LCAs) with the U.S. Department of Labor from 2021–2025, including 14 in 2025. The average H-1B salary is $102,903 and the most sponsored role is Engineer Ii-wireless.
Source: U.S. Department of Labor LCA disclosure data. Most recent filing on record: Aug 12, 2025.
LinkedIn ↗Latest Year Filings
14
In 2025
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Total H‑1B Filings
51
Since 2020
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Avg Annual Salary
$102,903
All years combined
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Top Role
Engineer Ii-wireless
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Filing trend
H‑1B filings by year for Dish Wireless L.l.c.
| Year | LCA filings | Avg salary |
|---|---|---|
| 2025 | 14 | $113,862 |
| 2023 | 4 | $117,514 |
| 2022 | 5 | $118,668 |
| 2021 | 28 | $92,521 |
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Yearly filings & average salary · swipe to explore
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Summary